copyright@ semipower electronic technology co., ltd. all rights reserved. july. 2013. rev. 3.0 1 /5 features high ruggedness r ds( on ) (max 11 m ? )@v gs =10v gate charge ( typ 74nc) improved dv/dt capability 100% avalanche tested general description this power mosfet is produced with advanced vdmos technology of samwin . this technology enable power mosfet to have better characteristics, such as fast switching time, low on resistance, low gate charge and especially excellent avalanche characteristics . this power mosfet is usually used at high efficient dc to dc converter block and switch mode power supply . n - channel to - 220 mosfet absolute maximum ratings symbol parameter value unit v dss drain to source voltage 80 v i d continuous drain current (@t c =25 o c) 75* a continuous drain current (@t c =100 o c) 47* a i dm drain current pulsed (note 1) 300 a v gs gate to source voltage 30 v e as single pulsed avalanche energy (note 2) 890 mj e ar repetitive avalanche energy (note 1) 160 mj dv/dt peak diode recovery dv/dt (note 3) 5 v/ns p d total power dissipation (@t c =25 o c) 227 w derating factor above 25 o c 1.8 w/ o c t stg , t j operating junction temperature & storage temperature - 55 ~ + 150 o c t l maximum lead temperature for soldering purpose, 1/8 from case for 5 seconds. 300 o c thermal characteristics symbol parameter value unit r thjc thermal resistance, junction to case 0.55 o c/w r thcs thermal resistance, case to sink 0.5 o c /w r thja thermal resistance, junction to ambient 56 o c /w *. drain current is limited by junction temperature. bv dss : 80v i d : 75a r ds(on) : 11 m ? 1. gate 2. drain 3. source 1 2 3 SW75N08 samwin item sales type marking package packaging 1 sw p 75n08 sw 75n08 to - 220 tube order codes 1 2 3 to - 220
copyright@ semipower electronic technology co., ltd. all rights reserved. july. 2013. rev. 3.0 2 /5 electrical characteristic ( t c = 25 o c unless otherwise specified ) symbol parameter test conditions min. typ. max. unit off characteristics bv dss drain to source breakdown voltage v gs =0v, i d =250ua 80 v bv dss / t j breakdown voltage temperature coefficient i d =250ua, referenced to 25 o c 0.07 v/ o c i dss drain to source leakage current v ds =80v, v gs =0v 1 ua v ds =80v, t c =125 o c 50 ua i gss gate to source leakage current, forward v gs =20v, v ds =0v 100 na v gs = - 20v, v ds =0v - 100 na gate to source leakage current, reverse on characteristics v gs(th) gate threshold voltage v ds =v gs , i d =250ua 2.0 4.0 v r ds(on) drain to source on state resistance v gs =10v, i d = 40a 8.9 11 m ? g fs forward transconductance v ds =20v, i d = 15 a 51 s dynamic characteristics c iss input capacitance v gs =0v, v ds =25v, f=1mhz 4700 pf c oss output capacitance 480 c rss reverse transfer capacitance 90 t d(on) turn on delay time v ds =45v, i d =75a, r g =25 ? (note 4 5) 47 80 ns tr rising time 93 150 t d(off) turn off delay time 112 200 t f fall time 77 150 q g total gate charge v ds =60v, v gs =10v, i d =70a (note 4 5) 74 140 nc q gs gate - source charge 18 q gd gate - drain charge 29 source to drain diode ratings characteristics symbol parameter test conditions min. typ. max. unit i s continuous source current integral reverse p - n junction diode in the mosfet 75 a i sm pulsed source current 300 a v sd diode forward voltage drop. i s =75a, v gs =0v 1.5 v t rr reverse recovery time i s =75a, v gs =0v, di f / dt =100a/us 26 ns q rr reverse recovery charge 26 nc . notes 1. repeatitive rating : pulse width limited by junction temperature. 2. l = 0.32mh, i as = 75a, v dd = 50v, r g =25 ?, starting t j = 25 o c 3. i sd 75a, di/dt = 100a/us, v dd bv dss , staring t j =25 o c 4. pulse test : pulse width 300us, duty cycle 2% 5. essentially independent of operating temperature. SW75N08 samwin
copyright@ semipower electronic technology co., ltd. all rights reserved. july. 2013. rev. 3.0 3 /5 fig. 1. on - state characteristics fig. 2. on - resistance variation vs. drain current and gate voltage fig. 3. gate charge characteristics SW75N08 samwin fig. 4. on state current vs. diode forward voltage fig 5. breakdown voltage variation vs. junction temperature fig. 6. on resistance variation vs. junction temperature
copyright@ semipower electronic technology co., ltd. all rights reserved. july. 2013. rev. 3.0 4 /5 SW75N08 samwin fig. 7. maximum safe operating area fig. 8. transient thermal response curve v dd dut v ds r l r gs 10v in 10% v ds v in 90% 10% t d(on) t r t on t d(off) t off t f fig. 9. gate charge test circuit & waveform fig.10. switching time test circuit & waveform v ds same type as dut dut v gs 6ma q g q gs q gd v gs charge nc 10v
copyright@ semipower electronic technology co., ltd. all rights reserved. july. 2013. rev. 3.0 5 /5 fig. 11. unclamped inductive switching test circuit & waveform SW75N08 samwin fig.12 . peak diode recovery dv/dt test circuit & waveform v dd same type as dut v ds l r g 10v gs i s + - v ds dut *. dv/dt controlled by rg *. is controlled by pulse period v gs (driver) i s (dut) v ds (dut) body diode forward voltage drop v f diode recovery dv/dt i rm di/dt 10v diode reverse current v dd
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